JPS6228780Y2 - - Google Patents

Info

Publication number
JPS6228780Y2
JPS6228780Y2 JP1980061788U JP6178880U JPS6228780Y2 JP S6228780 Y2 JPS6228780 Y2 JP S6228780Y2 JP 1980061788 U JP1980061788 U JP 1980061788U JP 6178880 U JP6178880 U JP 6178880U JP S6228780 Y2 JPS6228780 Y2 JP S6228780Y2
Authority
JP
Japan
Prior art keywords
lead frame
heat sink
pad
support piece
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1980061788U
Other languages
English (en)
Japanese (ja)
Other versions
JPS56164562U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980061788U priority Critical patent/JPS6228780Y2/ja
Publication of JPS56164562U publication Critical patent/JPS56164562U/ja
Application granted granted Critical
Publication of JPS6228780Y2 publication Critical patent/JPS6228780Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1980061788U 1980-05-08 1980-05-08 Expired JPS6228780Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980061788U JPS6228780Y2 (en]) 1980-05-08 1980-05-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980061788U JPS6228780Y2 (en]) 1980-05-08 1980-05-08

Publications (2)

Publication Number Publication Date
JPS56164562U JPS56164562U (en]) 1981-12-07
JPS6228780Y2 true JPS6228780Y2 (en]) 1987-07-23

Family

ID=29656159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980061788U Expired JPS6228780Y2 (en]) 1980-05-08 1980-05-08

Country Status (1)

Country Link
JP (1) JPS6228780Y2 (en])

Also Published As

Publication number Publication date
JPS56164562U (en]) 1981-12-07

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